SI Analysis

SPISim provides SI analysis services:

We provide comprehensive system level SI/PI simulation services at package & PCB level and can resovle any kind of complex SI issue, PI issue for any problem related with s-parameters in the post-layout design.

  • High speed serial/parallel interface analysis and design guidelines (DDR3, DDR4, multi-gigabit Serdes,  PCIe gen3 & gen4, XAUI, HDMI, SATA, USB, chip-to-chip IO, FPGA IO)
  • Signal integrity & power integrity co-design SSN modeling
  • pre-layout & post-layout SI/PI analysis.
  • IBIS/IBIS-AMI based system level SI evaluation.
  • Routing studies, termination schemes, stackup design & analysis.
  • Trace & Via design for controlled impedance using EM solver.
  • Full-wave EM modeling of all kinds of interconnects (via, connector, end-to-end channel)
  • Crosstalk and s-parameter modeling of traces and interconnects on package and board.
  • Analyze and verify power supply quality at chip, package & board level.
  • Target impedance estimation and optimization.
  • Decoupling cap estimation and optimization
  • Power-ground loop inductance & stackup optimization.
  • S-parameter & parasitic extraction (R,L,C)
  • IR drop analysis and give recommendation about placement of components.
  • time-domain power integrity noise estimation.