SPISim provides SI analysis services:

We provide comprehensive system level SI/PI simulation services at package & PCB level and can resovle any kind of complex SI issue, PI issue for any problem related with s-parameters in the post-layout design.

• High speed serial/parallel interface analysis and design guidelines (DDR3, DDR4, multi-gigabit Serdes,  PCIe gen3 & gen4, XAUI, HDMI, SATA, USB, chip-to-chip IO, FPGA IO)
• Signal integrity & power integrity co-design SSN modeling
• pre-layout & post-layout SI/PI analysis.
• IBIS/IBIS-AMI based system level SI evaluation.
• Routing studies, termination schemes, stackup design & analysis.
• Trace & Via design for controlled impedance using EM solver.
• Full-wave EM modeling of all kinds of interconnects (via, connector, end-to-end channel)
• Crosstalk and s-parameter modeling of traces and interconnects on package and board.
• Analyze and verify power supply quality at chip, package & board level.
• Target impedance estimation and optimization.
• Decoupling cap estimation and optimization
• Power-ground loop inductance & stackup optimization.
• S-parameter & parasitic extraction (R,L,C)
• IR drop analysis and give recommendation about placement of components.
• time-domain power integrity noise estimation.